Tivar® H.O.T.


Brand:

  • Resistance guaranteed up to +135°C (depending on stresses)
  • Anti-oxidising properties
  • Compliant with food standards (ref. description)
  • Low sliding friction coefficient
  • High abrasion resistance

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This material contains additives that slow down oxidation and prolong the service life of the material even at 
high temperatures (+80 °C up to +135 °C, depending on stresses).

Its peculiar features make TIVAR® H.O.T. an economic alternative to PTFE or polyamide.

Specifications:
Resistant to very high temperatures; 
Anti-oxidising properties; 
Compliant with food contact requirements based on Regulation (EU) 10/2011, FDA directive 21CFR177.1520, FDA directive 21CFR178.2010 
Low sliding friction coefficient;
High abrasion resistance ;
Durable resistance at high temperatures ;
Excellent resistance to chemicals;
No humidity absorption.

Examples of applications: bakery industry; production of sweets; form-fill-seal and packaging industry; chemical industry.


Properties ISO standard Unit of measurement Value
General properties      
Colour     white
Molecular weight -- g/mol 9x106
Density (specific weight) 1183 g/cm3 0.93
Water absorption 62 % <0.1
       
Mechanical properties      
Tensile strain at break 527 % >50
Tensile strain at yield 527 MPa 19
Tensile modulus of elasticity 527 MPa 700
Impact strength (Charpy impact test - notched) 179/1eA kJ/m2 100P
Hardness 53505 Scale D 58
       
Thermal properties      
Melting temperature 11357 °C 135
Thermal conductivity 52612 W/mK 0.4
Coefficient of linear thermal expansion av. value between 20 °C and 60 °C m/mK 200x10-6
Working temperature. continuously -- °C -200/+110
Working temperature. for short periods -- °C 135
Flammability UL94 -- HB
       
Electric properties      
Dielectric strength 60243 kV/mm 45
Volume resistivity 60093 Ohm/cm >1014
Surface resistivity 60093 Ohm >1012
       
Physiological properties      
Suitable for contact with foodstuffs 21CFR (FDA) -- Yes



Although the information provided in this product data sheet is confirmed by reliable research, POLITECNICA CETAI shall not take any responsibility for the application, processing or use of such information.