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Techtron® HPV PPS
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- Extremely high maximum service temperature in air;
- High mechanical strength, creep resistance and stiffness, even at elevated temperatures;
- Excellent behaviour under wear and friction;
- Excellent chemical and hydrolysis resistance;
- Very good dimensional stability;
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Polyphenylene Sulphide (PPS)
This reinforced and internally lubricated grade of polyphenylene sulphide offers an excellent combination of properties such as load strength, wear resistance, and dimensional stability, even when exposed to environments with chemicals and high temperatures.
TECHTRON® HPV PPS may be used for applications where PA, POM, PET, PEI and PSU are likely to fail, or where PBI, PEEK and PAI are too expensive and a cheaper solution is required.
Uniform spreading of the internal lubricant results in excellent resistance to wear and a low friction coefficient.
It exceeds the limits of virgin PPS, which is characterised by a high friction coefficient, and the limits of fibreglass reinforced PPS which cause early wear of the matching element in sliding applications.
Combined with excellent chemical resistance, these features make the product usable for a multitude of possible applications in any type of industry.
Specifications
- Extremely high maximum service temperature in air (+220 °C continuously and up to +260 °C for short periods)
- High mechanical strength, creep resistance and stiffness, even at elevated temperatures
- Excellent behaviour under wear and friction
- Excellent chemical and hydrolysis resistance
- Very good dimensional stability
- Good electrical insulating and dielectric properties
- Low intrinsic flammability
- Excellent resistance against high energy radiation
| Properties | ISO / (IEC) standard | Unit of measurement | Value |
| General | |||
| Colour | Dark blue | ||
| Density | 1183-1 | g/cm3 | 1.42 |
| Water absorption: | |||
| - after 24/ 96 h immersion in | 62 | mg | 1/2 |
| water at 23 °C | |||
| 62 | % | 0.01/0.02 | |
| - at saturation in air of 23 °C / 50% RH | -- | % | 0.05 |
| - at saturation in water of 23 °C | -- | % | 0.2 |
| Thermal properties | |||
| Melting temperature | 11357-1/-3 | °C | 280 |
| Glass transition temperature | 11357-1/-2 | °C | -- |
| Thermal conductivity at 23 °C | - | W (K.m) | 0.3 |
| Average coefficient of linear thermal expansion: | |||
| - average value between 23 and 100 °C | - | m/(m.K) | 50x10-6 |
| - average value between 23 and 150 °C | - | m/(m.K) | 60x10-6 |
| - average value above 150 °C | - | m((m.K) | 100x10-6 |
| Deflection temperature under load: | |||
| - method A: 1.8 MPa | 75-1/-2 | °C | 115 |
| Max. service temperature in air: | |||
| - for short periods | - | °C | 260 |
| - continuously: min. 20.000 h | - | °C | 220 |
| Min. service temperature | -20 | ||
| Flammability: | |||
| “Oxygen index” | 4589-1/-2 | % | 44 |
| - according to method UL 94 | - | - | V-0/V-0 |
| (1.5/3 mm thickness) | |||
| Mechanical properties at 23 °C | |||
| Tension test | |||
| - Tensile stress at yield / Ultimate tensile strenght | 527-1/-2 | MPa | NYP/78 |
| - Tensile strain at break | 527-1/-2 | % | 3.5 |
| - Tensile modulus of elasticity | 527-1/-2 | MPa | 4000 |
| Compression test: | |||
| - Compressive stress at 1% nominal strain | 604 | MPa | 33 |
| - Compressive stress at 2% nominal strain | 604 | MPa | 65 |
| Charpy impact strength - unnotched | 179-1/1eU | kJ/m2 | 25 |
| Charpy impact strength - notched | 179-1/1eA | kJ/m2 | 4 |
| Ball indentation hardness | 2039-1 | N/mm2 | 160 |
| Rockwell hardness | 2039-2 | - | M 82 |
| Electrical properties at 23 °C | |||
| Dielectric strength | (60243-1) | kV/mm | 24 |
| Volume resistivity | (60093) | Ohm.sq | >1014 |
| Surface resistivity | ANSI/ESD | Ohm.sq | >1013 |
| STM 1111 | |||
| Relative permittivity: | 60250 | -- | 3.3 |
| at 100 Hz | |||
| at 1 MHz | 60250 | -- | 3.3 |
| Dielectric dissipation factor. tan ‰: | 60250 | -- | 0.003 |
| at 100 Hz | |||
| at 1 MHz | 60250 | -- | 0.003 |
| Comparative Tracking Index | 60112 | -- | 100 |
| (CTI) |
Although the information provided in this product data sheet is confirmed by reliable research, POLITECNICA CETAI shall not take any responsibility for the application, processing or use of such information.
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