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Ketron® PEEK - 1000
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- Extremely high maximum operating temperature in air
- High mechanical strength, creep resistance and stiffness, even at elevated temperatures
- Excellent chemical and hydrolysis resistance
- Excellent behaviour under wear and friction
- Low intrinsic flammability and extremely low emission of fumes during combustion
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These semi-finished products are made with virgin polyetheretherketone resin and offer the strongest toughness and impact strength amongall KETRON® PEEK grades.
The composition of the raw materials used for the manufacture of natural KETRON® PEEK semi-finished products is compliant with the directives of the European Union and of the FDA (USA) as regards food compatibility, as well as with USP standards, class VI, concerning biocompatibility.
These features in combination with excellent sterilization results with steam, dried air, ethylene oxide and gamma radiation make this grade the most frequently used option in applications for the medical, pharmaceutical, and food industries.
Specifications
- Extremely high maximum operating temperature in air (+250 °C continuously, with peaks up to +350 °C)
- High mechanical strength, creep resistance and stiffness, even at elevated temperatures
- Excellent chemical and hydrolysis resistance
- Excellent behaviour under wear and friction (in particular for KETRON® PEEK - HPV and CA 30)
- Low intrinsic flammability and extremely low emission of fumes during combustion
- Very good dimensional stability
- Good electrical insulation and dielectric properties (except for KETRON® PEEK - HPV and CA 30)
- Excellent resistance against high energy radiation
| Properties | ISO / (IEC) standard | Unit of measurement | Value |
| General properties | |||
| Colour | Natural / black | ||
| Density | 1183-1 | g/cm3 | 1.31 |
| Water absorption: | |||
| - after 24/96 h immersion in | 62 | mg | 5/10 |
| water at 23 °C | |||
| 62 | % | 0.06/0.12 | |
| - at saturation in air of 23 °C / 50% RH | -- | % | 0.2 |
| - at saturation in water of 23 °C | -- | % | 0.45 |
| Thermal properties | |||
| Melting temperature | 11357-1/-3 | °C | 340 |
| Glass transition temperature | 11357-1/-2 | °C | -- |
| Thermal conductivity at 23 °C | - | W (K.m) | 0.25 |
| Average coefficient of linear thermal expansion: | |||
| - average value between 23 and 100 °C | - | m/(m.K) | 50x10-6 |
| - average value between 23 and 150 °C | - | m/(m.K) | 55x10-6 |
| - average value above 150 °C | - | m((m.K) | 130x10-6 |
| Deflection temperature under load: | |||
| - method A: 1.8 MPa | 75-1/-2 | °C | 160 |
| Max. operating temperature in air: | |||
| - for short periods | - | °C | 310 |
| - continuously: min. 20.000 h | - | °C | 250 |
| Min. operating temperature | -50 | ||
| Flammability: | |||
| "oxygen index" | 4589-1/-2 | % | 35 |
| - according to method UL 94 | - | - | V-0/V-0 |
| (1.5/3 mm thickness) | |||
| Mechanical properties at 23 °C | |||
| Tension test | |||
| - Tensile stress at yield / Ultimate tensile strength | 527-1/-2 | MPa | 115/- |
| - Tensile strain at break | 527-1/-2 | % | 17 |
| - Tensile modulus of elasticity | 527-1/-2 | MPa | 4300 |
| Compression test | |||
| - Compressive stress at 1% nominal strain | 604 | MPa | 38 |
| - Compressive stress at 2% nominal strain | 604 | MPa | 75 |
| Charpy impact strength - unnotched | 179-1/1eU | kJ/m2 | Natural rubber (NR) |
| Charpy impact strength - notched | 179-1/1eA | kJ/m2 | 3.5 |
| Ball indentation hardness | 2039-1 | N/mm2 | 210 |
| Rockwell hardness | 2039-2 | - | M 105 |
| Electrical properties at 23 °C | |||
| Dielectric strength | (60243-1) | kV/mm | 24 |
| Volume resistivity | (60093) | Ohm.sq | >1014 |
| Surface resistivity | ANSI/ESD | Ohm.sq | >1013 |
| STM 1111 | |||
| Relative permittivity: | (60250) | -- | 3.2 |
| at 100 Hz | |||
| at 1 MHz | (60250) | -- | 3.2 |
| Dielectric dissipation factor. tan ‰: | (60250) | -- | 0.001 |
| at 100 Hz | |||
| at 1 MHz | (60250) | -- | 0.002 |
| Comparative Tracking Index | (60112) | -- | 150 |
| (CTI) |
Although the information provided in this product data sheet is confirmed by reliable research, POLITECNICA CETAI shall not take any responsibility for the application, processing or use of such information.
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