Search products
Categories
Search product
Categories
PE HD 1000 - PE-UHMW
Brand: 
- Excellent wear and abrasion resistance
- Remarkable impact strength
- Resists up to -200 °C
- Suitable for contact with foodstuffs
Interested in this product?
Molecular weight, approx. 5,000,000 g/mol
Compared to all other very high molecular weight polyethylene formulations, PE HD 1000 shows the best and most balanced mix of miscellaneous properties.
It combines excellent wear and abrasion resistance properties to an outstanding impact strength, even at temperatures below -200 °C.
Main applications: mechanical industry, in general; bottling, canning and packaging industries; chemical, electroplating and cryogenic industries; textile industry, and high-volume material storage systems
| Properties | ISO standard | Unit of measurement | Value |
| General properties | |||
| Colour | natural / black / green | ||
| Molecular weight | -- | g/mol | 5x10-6 |
| Density (specific weight) | 1183-1 | g/cm3 | 0.93 |
| Water absorption | -- | % | <0.1 |
| Mechanical properties | |||
| Tensile strain at break | 527-1/-2 | % | >50 |
| Tensile strain at yield | 527-1/-2 | MPa | 19 |
| Tensile modulus of elasticity | 527-1/-2 | MPa | 750 |
| Impact strength (Charpy impact test - notched) | 179-1/1eA | kJ/m2 | 115 P |
| Hardness | 868 | Scale D | 60 |
| Thermal properties | |||
| Melting temperature | 11357-1/-3 | °C | 135 |
| Thermal conductivity at 23 °C | W/mK | 0.4 | |
| Coefficient of linear thermal expansion | av. value between 23 °C and 100 °C | m/mK | 200x10-6 |
| Working temperature, continuously | -- | °C | -200/+80 |
| Working temperature, for short periods | -- | °C | 120 |
| Flammability | UL94 | -- | HB |
| Electric properties | |||
| Dielectric strength | 60243-1 | kV/mm | 45 |
| Volume resistivity | 60093 | Ohm/cm | >1014 |
| Surface resistivity | 60093 | Ohm | >1012 |
| Physiological properties | |||
| Suitable for contact with foodstuffs | 21CFR (FDA) | -- | Yes |
Although the information provided in this product data sheet is confirmed by reliable research, POLITECNICA CETAI shall not take any responsibility for the application, processing or use of such information.
Share